ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,633, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor module and power converter" was invented by Sho... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,635, issued on Sept. 22, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Sota Yamaguchi (... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,636, issued on Sept. 22, was assigned to Marel Power Solutions (Plymouth, Mich.). "Liquid cooled compact power systems" was invented by Ia... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,637, issued on Sept. 22, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Power semiconductor module and man... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,638, issued on Sept. 22, was assigned to Frore Systems Inc. (San Jose, Calif.). "Piezoelectric MEMS-based active cooling for heat dissipat... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,639, issued on Sept. 22, was assigned to Board Of Trustees Of The University Of Arkansas (Little Rock, Ark.). "Apparatus and method to red... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,640, issued on Sept. 22, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device, power conversion device and moving body... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,641, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor devices with du... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,642, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Device, method, and system to mitigate warpage of a composite... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,643, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including support me... Read More